Qualcomm Snapdragon 845 vs HiSilicon Kirin 970

SOC Specs Compare

CPU

Architecture
4x 2.8 GHz – Kryo 385 Gold (Cortex-A75)4x 1.8 GHz – Kryo 385 Silver (Cortex-A55)
4x 2.36 GHz – Cortex A734x 1.84 GHz – Cortex A53
Frequency
2800 MHz
2360 MHz
Cores
8
8
Instruction set
ARMv8.2-A
ARMv8-A
L1 cache
128 KB
512 KB
L2 cache
0
0
L3 cache
0
0
Process
10 nm
10 nm
Transistor count
3
5.5
TDP
9 W
9 W
Manufacturing
Samsung
TSMC

Graphics

GPU name
Adreno 630
Mali-G72 MP12
GPU frequency
710 MHz
768 MHz
Execution units
2
12
Shading units
256
18
Vulkan version
1.1
1.3
OpenCL version
2.0
2.0
DirectX version
12.1
12

Memory

Memory Type
LPDDR4X
LPDDR4X
Memory frequency
1866 MHz
1866 MHz
Bus
2x 32 Bit
4x 16 Bit
Max bandwidth
29.8 Gbit/s
29.8 Gbit/s

Multimedia (ISP)

Neural processor (NPU)
Hexagon 685
Yes
Storage type
UFS 2.1
UFS 2.1
Max display resolution
3840 x 2160
3120 x 1440
Max camera resolution
1x 192MP
1x 48MP, 2x 20MP
Video capture
4K at 60FPS
4K at 30FPS
Video playback
4K at 60FPS
4K at 30FPS
Video codecs
H.264, H.265, VP9
H.264, H.265, VP8, VP9, VC-1
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
32 bit@384 kHz, HD-audio

Connectivity

4G support
LTE Cat. 18
LTE Cat. 18
5G support
No
No
Download speed
Up to 1200 Mbps
Up to 1200 Mbps
Upload speed
Up to 150 Mbps
Up to 150 Mbps
Wi-Fi
5
5
Bluetooth
5.0
4.2
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS
GPS, GLONASS, Beidou, Galileo

Info

Announced
Dec 2017
Sep 2017
Class
Flagship
Flagship
Model number
SDM845
Hi3670
Official page

📊 Benchmark

AnTuTu 10
448,489
355,946
Geekbench 6
566
386
Geekbench 6
2,075
1,377
FP32 (float)
727
331