MediaTek Dimensity 6400 vs HiSilicon Kirin 970

SOC Specs Compare

CPU

Architecture
2x 2.5 GHz – Cortex-A766x 2 GHz – Cortex-A55
4x 2.36 GHz – Cortex A734x 1.84 GHz – Cortex A53
Frequency
2500 MHz
2360 MHz
Cores
8
8
Instruction set
ARMv8.2-A
ARMv8-A
L1 cache
512 KB
512 KB
L2 cache
1 MB
0
L3 cache
2 MB
0
Process
6 nm
10 nm
Manufacturing
TSMC
TSMC
Transistor count
-
5.5
TDP
-
9 W

Graphics

GPU name
Mali-G57 MP2
Mali-G72 MP12
Shading units
64
18
Vulkan version
1.3
1.3
OpenCL version
2.0
2.0
DirectX version
12
12
GPU frequency
-
768 MHz
Execution units
-
12

Memory

Memory Type
LPDDR4X
LPDDR4X
Memory frequency
2133 MHz
1866 MHz
Bus
2x 16 Bit
4x 16 Bit
Max bandwidth
17.07 Gbit/s
29.8 Gbit/s

AI

NPU
Yes
-

Multimedia (ISP)

Storage type
UFS 2.2
UFS 2.1
Max display resolution
2520 x 1080
3120 x 1440
Max camera resolution
1x 108MP, 2x 16MP
1x 48MP, 2x 20MP
Video capture
2K at 30FPS
4K at 30FPS
Video playback
2K at 30FPS
4K at 30FPS
Video codecs
- H.264- H.265- VP9
H.264, H.265, VP8, VP9, VC-1
Audio codecs
- AAC LC- FLAC- HE-AACv1- HE-AACv2- MP3
32 bit@384 kHz, HD-audio
Neural processor (NPU)
-
Yes

Connectivity

5G support
Yes
No
Download speed
Up to 3300 Mbps
Up to 1200 Mbps
Wi-Fi
5
5
Bluetooth
5.4
4.2
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
GPS, GLONASS, Beidou, Galileo
4G support
-
LTE Cat. 18
Upload speed
-
Up to 150 Mbps

Info

Announced
Feb 2025
Sep 2017
Class
Mid range
Flagship
Official page
Model number
-
Hi3670

📊 Benchmark

AnTuTu 10
446,033
355,946
Geekbench 6
-
386
Geekbench 6
-
1,377
FP32 (float)
-
331