MediaTek Dimensity 6300 vs HiSilicon Kirin 970

SOC Specs Compare

CPU

Architecture
2x 2.4 GHz – Cortex-A766x 2 GHz – Cortex-A55
4x 2.36 GHz – Cortex A734x 1.84 GHz – Cortex A53
Frequency
2400 MHz
2360 MHz
Cores
8
8
Instruction set
ARMv8.2-A
ARMv8-A
Process
6 nm
10 nm
Manufacturing
TSMC
TSMC
L1 cache
-
512 KB
L2 cache
-
0
L3 cache
-
0
Transistor count
-
5.5
TDP
-
9 W

Graphics

GPU name
Mali-G57 MP2
Mali-G72 MP12
Execution units
2
12
Shading units
64
18
Vulkan version
1.3
1.3
OpenCL version
2.0
2.0
GPU frequency
-
768 MHz
DirectX version
-
12

Memory

Memory Type
LPDDR4X
LPDDR4X
Memory frequency
2133 MHz
1866 MHz
Bus
2x 16 Bit
4x 16 Bit
Max bandwidth
17.07 Gbit/s
29.8 Gbit/s

AI

NPU
Yes
-

Multimedia (ISP)

Neural processor (NPU)
Yes
Yes
Storage type
UFS 2.2
UFS 2.1
Max display resolution
2520 x 1080
3120 x 1440
Max camera resolution
1x 108MP, 2x 16MP
1x 48MP, 2x 20MP
Video capture
2K at 30FPS
4K at 30FPS
Video playback
2K at 30FPS
4K at 30FPS
Video codecs
H.264, H.265, VP9
H.264, H.265, VP8, VP9, VC-1
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
32 bit@384 kHz, HD-audio

Connectivity

5G support
Yes
No
Download speed
Up to 3300 Mbps
Up to 1200 Mbps
Wi-Fi
5
5
Bluetooth
5.2
4.2
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
GPS, GLONASS, Beidou, Galileo
4G support
-
LTE Cat. 18
Upload speed
-
Up to 150 Mbps

Info

Announced
Apr 2024
Sep 2017
Class
Mid range
Flagship
Official page
Model number
-
Hi3670

📊 Benchmark

AnTuTu 10
447,617
355,946
Geekbench 6
-
386
Geekbench 6
-
1,377
FP32 (float)
-
331